Integrated circuit test temperature control mechanism

ABSTRACT

A thermal controller includes a thermal control interface to receive test data from an automated test equipment (ATE) system and dynamically adjust a target setpoint temperature based on the data and a dynamic thermal controller to receive the target setpoint temperature from the thermal control interface and control a thermal actuator based on the target setpoint temperature.

FIELD OF THE INVENTION

The present disclosure generally relates to integrated circuits, andmore particularly, to testing integrated circuits.

BACKGROUND

Integrated circuits (ICs) are designed to operate under a variety ofenvironmental conditions. For example, ICs are designed to operate overa range of temperatures. To ensure that an IC operates correctly over aparticular range of temperatures, the IC is coupled to a test unit fortesting at different temperatures within the particular range. The testunit typically includes a thermal unit that facilitates thermalheating/cooling and control for testing.

Current thermal systems that control device temperature during testingimplement a traditional approach by attempting to control to a fixedtemperature setpoint. However, modern complex IC devices have diversethermal management requirements during testing. Such requirementsinclude an accurate, stable, fixed temperature with near isothermalconditions calibrating the device's built in temperature sensors, arapidly responding temperature control to minimize device temperaturechanges while device power is changing dynamically during a test, anddifferent target test temperatures depending on the product's inherentperformance and targeted application. The change in target temperatureis on a device by device basis and actually changes as the device testflow is progressing.

Additionally, there may be a need to change test temperature on an ICwhile the device is in a test socket in order to accommodate new testapplications. For example, during hot testing, test data may indicatethe need for the device to also be tested at a cold test temperature toadequately screen for possible defect types. A device test socket mayinclude stress screening at temperatures that are elevated relative tothe testing temperature.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates a conventional test system.

FIGS. 2A and 2B illustrate embodiments of a test system.

FIG. 3 illustrates another embodiment of a test system.

FIG. 4 illustrates one embodiment of a computer system.

DETAILED DESCRIPTION

In the following description, numerous specific details are set forth inorder to provide a thorough understanding of various embodiments.However, various embodiments of the invention may be practiced withoutthe specific details. In other instances, well-known methods,procedures, components, and circuits have not been described in detailso as not to obscure the particular embodiments of the invention.

Reference in the specification to “one embodiment” or “an embodiment”means that a particular feature, structure, or characteristic describedin connection with the embodiment may be included in at least animplementation. The appearances of the phrase “in one embodiment” invarious places in the specification may or may not be all referring tothe same embodiment.

FIG. 1 illustrates a conventional test system 100. System 100 includesan automated test equipment (ATE) system 110 implemented to performthermal testing on a device under test (DUT) 130. DUT 130 may be an ICdie on a wafer, or a packaged part. In one embodiment, ATE system 110 iscoupled to DUT 130 via a device interface 120 and test contactor.

System 100 also includes a thermal actuator 140 having a conductionsurface 142. Thermal actuator 140 is used to physically heat or cool thetemperature of DUT 130 during testing. A thermal controller 150 iselectrically coupled to actuator 140 to control the temperature of DUT130 via actuator 140. Thus, thermal controller 150 transmits heating andcooling control signals to actuator 140 in order to maintain DUT 130 ata fixed setpoint temperature based on feedback temperature of conductionsurface 142 received from actuator 140.

As discussed above, there are limitations to systems like test system100, which attempt to control to a fixed temperature setpoint. Thus,according to one embodiment, a test system is disclosed that providesdynamic control inputs as well as the traditional test features. FIG. 2Aillustrates one embodiment of a test system 200. As shown in FIG. 2A,test system 200 includes similar features to system 100 discussed above.However in this embodiment, a thermal controller 250 is coupled tothermal actuator 140 for thermal management of DUT 130.

Thermal controller 250 includes a thermal control interface (TCI) 252and a dynamic thermal controller (DTC) 255. In one embodiment, TCI 252is electrically coupled to ATE system 110 to translate inputs from theATE system 110 in order to dynamically adjust a target temperaturesetpoint based on various test related conditions and test programcommands.

In one embodiment, DTC 255 controls thermal actuator 140 using a fastresponse control loop that accepts a streaming dynamic temperaturesetpoint value from the TCI 252. In such an embodiment, TCI 252 receivesthe feedback temperature from actuator 140 and transmits streamingtemperature setpoint data to a temperature control loop module 257within DTC 255 via a digital interface.

FIG. 3 illustrates one embodiment of a control loop performed by DTC255, in which a traditional proportional-integral-derivative (PID)control methodology is used. For fast control response, DTC 255 mayoperate at a rate that is much faster than the time constant of theactuator 140 temperature response and also faster than the temperaturestreaming update rate.

DTC 255 also includes a control and mode select module coupled to thedigital interface to select a mode of operation (e.g., traditionalstatic or dynamic mode) for DTC 255. In one embodiment, the interface isimplemented with a simple protocol two-wire interface such as theInter-Integrated Circuit (I²C) interface.

However other interfaces (e.g., SPI, RS-422, etc.) may be implemented inother embodiments. In such an embodiment, a flexible digitalcommunications protocol using simple commands (defined headers in thecase of a serial protocol) is implemented for command/control andtemperature streaming busses. FIG. 2B illustrates another embodiment ofa test system 200 in which TCI 252 is included within ATE system 110,rather than thermal controller 250.

In both embodiments DTC 255 is responsible for controlling to thesetpoint temperature and maintaining control of actuator 140.Additionally, DTC 255 is responsible for avoiding any conditions thatmight damage actuator 140 or the control system.

The above-described mechanism provides independent modular controlcomponents that enable matching various thermal control solutions withvarious ATE test applications by providing temperature in a streamingprotocol. Moreover, the mechanism avoids complicated schemes to alignand calibrate scaled analog signals between systems.

FIG. 4 illustrates one embodiment of a computer system 400. The computersystem 400 (also referred to as the electronic system 400) as depictedcan embody a test system that includes a thermal controller having athermal control interface to receive test data from an automated testequipment (ATE) system and dynamically adjust a target setpointtemperature based on the data and a dynamic thermal controller toreceive the target setpoint temperature from the thermal controlinterface and control a thermal actuator based on the target setpointtemperature.

The computer system 400 may be a mobile device such as a netbookcomputer. The computer system 400 may be a mobile device such as awireless smart phone. The computer system 400 may be a desktop computer.The computer system 400 may be a hand-held reader. The computer system400 may be a server system. The computer system 400 may be asupercomputer or high-performance computing system.

In an embodiment, the electronic system 400 is a computer system thatincludes a system bus 420 to electrically couple the various componentsof the electronic system 400. The system bus 420 is a single bus or anycombination of busses according to various embodiments. The electronicsystem 400 includes a voltage source 430 that provides power to theintegrated circuit 410. In some embodiments, the voltage source 430supplies current to the integrated circuit 610 through the system bus420.

The integrated circuit 410 is electrically coupled to the system bus 420and includes any circuit, or combination of circuits according to anembodiment. In an embodiment, the integrated circuit 410 includes aprocessor 412 that can be of any type. As used herein, the processor 412may mean any type of circuit such as, but not limited to, amicroprocessor, a microcontroller, a graphics processor, a digitalsignal processor, or another processor. In an embodiment, the processor412 includes a thermal controller having a thermal control interface toreceive test data from an automated test equipment (ATE) system anddynamically adjust a target setpoint temperature based on the data and adynamic thermal controller to receive the target setpoint temperaturefrom the thermal control interface and control a thermal actuator basedon the target setpoint temperature as disclosed herein.

In an embodiment, SRAM embodiments are found in memory caches of theprocessor. Other types of circuits that can be included in theintegrated circuit 410 are a custom circuit or an application-specificintegrated circuit (ASIC), such as a communications circuit 414 for usein wireless devices such as cellular telephones, smart phones, pagers,portable computers, two-way radios, and similar electronic systems, or acommunications circuit for servers. In an embodiment, the integratedcircuit 410 includes on-die memory 416 such as static random-accessmemory (SRAM). In an embodiment, the integrated circuit 410 includesembedded on-die memory 416 such as embedded dynamic random-access memory(eDRAM).

In an embodiment, the integrated circuit 410 is complemented with asubsequent integrated circuit 411. Useful embodiments include a dualprocessor 413 and a dual communications circuit 415 and dual on-diememory 417 such as SRAM. In an embodiment, the dual integrated circuit410 includes embedded on-die memory 417 such as eDRAM.

In an embodiment, the electronic system 400 also includes an externalmemory 440 that in turn may include one or more memory elements suitableto the particular application, such as a main memory 442 in the form ofRAM, one or more hard drives 444, and/or one or more drives that handleremovable media 446, such as diskettes, compact disks (CDs), digitalvariable disks (DVDs), flash memory drives, and other removable mediaknown in the art. The external memory 440 may also be embedded memory448 such as the first die in an embedded TSV die stack, according to anembodiment.

In an embodiment, the electronic system 400 also includes a displaydevice 450, an audio output 460. In an embodiment, the electronic system400 includes an input device such as a controller 470 that may be akeyboard, mouse, trackball, game controller, microphone,voice-recognition device, or any other input device that inputsinformation into the electronic system 400. In an embodiment, an inputdevice 470 is a camera. In an embodiment, an input device 470 is adigital sound recorder. In an embodiment, an input device 470 is acamera and a digital sound recorder.

As shown herein, the integrated circuit 410 can be implemented in anumber of different embodiments, including a test system that includes athermal controller having a thermal control interface to receive testdata from an automated test equipment (ATE) system and dynamicallyadjust a target setpoint temperature based on the data and a dynamicthermal controller to receive the target setpoint temperature from thethermal control interface and control a thermal actuator based on thetarget setpoint temperature, and their equivalents, an electronicsystem, a computer system, one or more methods of fabricating anintegrated circuit, and one or more methods of fabricating an electronicassembly that includes a semiconductor die packaged according to any ofthe several disclosed embodiments as set forth herein in the variousembodiments and their art-recognized equivalents. The elements,materials, geometries, dimensions, and sequence of operations can all bevaried to suit particular I/O coupling requirements including arraycontact count, array contact configuration for a microelectronic dieembedded in a processor mounting substrate according to any of theseveral disclosed semiconductor die packaged with a thermal interfaceunit and their equivalents. A foundation substrate may be included, asrepresented by the dashed line of FIG. 4. Passive devices may also beincluded, as is also depicted in FIG. 4.

Although embodiments of the invention have been described in languagespecific to structural features and/or methodological acts, it is to beunderstood that claimed subject matter may not be limited to thespecific features or acts described. Rather, the specific features andacts are disclosed as sample forms of implementing the claimed subjectmatter.

1.-18. (canceled)
 19. A test system comprising: an integrated circuit(IC) device; a thermal actuator coupled to the IC device to change atemperature of the IC device during testing; an automated test equipment(ATE) system coupled to the IC device, including a thermal controlinterface coupled to dynamically adjust a target setpoint temperaturefor testing the IC device; and a thermal controller, to control thetemperature of the IC device during testing, the thermal controllerincluding a dynamic thermal controller coupled to the thermal controlinterface and the thermal actuator to receive the target setpointtemperature from the thermal control interface and control the thermalactuator based on the target setpoint temperature.
 20. The test systemof claim 19 further comprising a digital interface coupled between thethermal control interface and the dynamic thermal controller.
 21. Thetest system of claim 19 wherein the dynamic thermal controller receivesthe target setpoint temperature from the dynamic thermal controller viathe digital interface as part of a real time data stream.
 22. The testsystem of claim 19 wherein the dynamic thermal controller comprises atemperature control loop module to control the thermal actuator.
 23. Thetest system of claim 19 wherein the thermal control interface receivesfeedback from the thermal actuator and transmits the target setpointtemperature to the temperature control loop module.
 24. The test systemof claim 19 wherein the dynamic thermal controller further comprises acontrol and mode select module to enable selection of a mode ofoperation.
 25. A method comprising: changing, by a thermal actuator,temperature of an integrated circuit (IC) device during testing, whereinthe thermal actuator is coupled to the IC device; dynamically adjusting,by a thermal control interface of an automated test equipment (ATE)system, a target setpoint temperature for testing the IC device, whereinthe ATE system is coupled to the IC device; controlling, by a thermalcontroller, the temperature of the IC device during testing, the thermalcontroller including a dynamic thermal controller coupled to the thermalcontrol interface and the thermal actuator to receive the targetsetpoint temperature from the thermal control interface and control thethermal actuator based on the target setpoint temperature.
 26. Themethod of claim 25 further comprising coupling a digital interfacebetween the thermal control interface and the dynamic thermalcontroller.
 27. The method of claim 25 wherein the target setpointtemperature is received by the dynamic thermal controller from thedynamic thermal controller via the digital interface as part of a realtime data stream.
 28. The method of claim 25 wherein the dynamic thermalcontroller comprises a temperature control loop module to control thethermal actuator.
 29. The method of claim 25 further comprisingreceiving, by the thermal control interface, feedback from the thermalactuator and transmitting, by the thermal control interface, the targetsetpoint temperature to the temperature control loop module.
 30. Themethod of claim 25 wherein the dynamic thermal controller furthercomprises a control and mode select module to enable selection of a modeof operation.